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After achieving the goal of grid parity, the photovoltaic industry still requires technological upgrades to enhance the conversion efficiency, per-watt power generation, and reduce the levelized cost of electricity (LCOE), to make solar energy as the main energy source.
On August 25th, at the Heterojunction and Tandem Industry Summit 2023 organized by Solarzoom, Jimmy Xu, Chairman of Huasun Energy and Jin Wang, Vice President of Huasun Energy, shared insights into the market developments of heterojunction (HJT) technology.
HJT technology has possessed a strong market visibility overseas. Jimmy Xu stated that Huasun has signed contract with overseas customer exceeding 1GW in a single order this year, and it is anticipated that overseas shipments will reach up to 2GW. Within China, Huasun has signed a cooperation agreement exceeding GW scale in a single order with some state-owned enterprise clients.
With the development of our business, HJT technology has reached a mature and pivotal stage. he stated. "As Huasun's production scale continues to expand, the shipment for both this year and the next will undoubtedly bring pleasant surprises to all."
Jimmy Xu pointed out that overseas customers are more concerned about the power generation and carbon footprint, while Chinese customers are more focused on power differences and pricing premiums within the same module type. Faced with diversified market demands, Huasun is continuously enhancing product quality and actively driving cost efficiency.
In the report titled The Carbon Reduction Journey of Specialized Silicon Wafers for HJT Cells, Jin Wang， Vice President of Huasun, pointed out that the combined technology of FBR+CCZ+Selective Doping+Ultra-thin Half-cut+SE Wafer represents the most carbon-efficient and cost-effective solution for dedicated silicon wafers in HJT technology. It is projected to reduce carbon emissions by 84g per watt.
In the crystal pulling stage, under the current conditions where the CCZ process has not been fully optimized, cell outcomes like those of the conventional RCZ process have been attained. However, further improvements are needed in terms of improving the concentration of resistivity and the minority carrier lifetime in the future.
In the doping phase, Huasun's independently developed precision doping system has been launched and put into operation. This system will contribute to a clearer identification of crystal quality, as well as the optimization of doping requirements and costs.
In the slicing phase, the specialized equipment based on the half-cut process has been fully put into operation, aiming to balance production capacity on the same surface area while enhancing product processing and testing precision. The new half-cut process is expected to level and potentially surpass the cost of HJT-dedicated silicon wafer solutions with whole-cut solutions.
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